Curved display device

ABSTRACT

A curved display device includes a semiconductor chip package including a base film, a plurality of driving chips on the base film, and an input wire unit and an output wire unit connected to the driving chips, a printed circuit board (PCB) connected to the input wire unit of the semiconductor chip package, and a display panel including a display unit and a pad unit connected to the output wire unit of the semiconductor chip package, wherein the display panel, the semiconductor chip package, and the PCB are bendable in a first direction, and the driving chips of the of the semiconductor chip package are separated from each other in the first direction.

CROSS-REFERENCE TO RELATED APPLICATION

Korean Patent Application No. 10-2014-0127053, filed on Sep. 23, 2014,in the Korean Intellectual Property Office, and entitled: “CurvedDisplay Device,” is incorporated by reference herein in its entirety.

BACKGROUND

1. Field

The described technology relates generally to a curved display device,and more particularly, to a curved display device including achip-on-film semiconductor chip package.

2. Description of the Related Art

A flat panel display, e.g., a liquid crystal display (LCD) and anorganic light emitting diode (OLED) display, includes a display unitformed of a plurality of pixels disposed on a substrate, to performpredetermined display by controlling on and off of the pixels andluminance. Glass is typically used as a substrate for the flat paneldisplay. However, a flexible display device that can be bent or foldedhas recently been developed by employing a flexible material, e.g.,plastic, as the substrate.

The flexible display device may be applied to a small electronic device,e.g., a mobile device, and a large electronic device, e.g., atelevision. In the case of the large electronic device, the flexibledisplay device can provide a bent screen to apply a 3D effect to thescreen that is viewed by a user. For example, a curved display devicethat is concavely bent with respect to a viewer satisfies all viewingangles of the viewer, as compared with a flat display device, and hasless image distortion according to the viewing angles.

Similar to the flat display device, the curved display device has abasic configuration including a display panel, a printed circuit board(PCB), and a chip-on-film semiconductor chip package which connects thedisplay panel to the PCB. The semiconductor chip package may include adriving chip and wires that are connected to the driving chip. The PCBoutputs a control signal for controlling the driving chip.

SUMMARY

The described technology has been made in an effort to provide a curveddisplay device capable of preventing a defect, e.g., a crack orpeeling-off of a semiconductor chip package, by reducing stress appliedto the semiconductor chip package by bending.

An exemplary embodiment provides a curved display device, including asemiconductor chip package including a base film, a plurality of drivingchips on the base film, and an input wire unit and an output wire unitconnected to the driving chips, a printed circuit board (PCB) connectedto the input wire unit of the semiconductor chip package, and a displaypanel including a display unit and a pad unit connected to the outputwire unit of the semiconductor chip package, wherein the display panel,the semiconductor chip package, and the PCB are bendable in a firstdirection, and the driving chips of the of the semiconductor chippackage are separated from each other in the first direction.

The input wire unit may be simultaneously connected to the plurality ofdriving chips, and a connection wire for transferring a carry signal maybe disposed between adjacent driving chips. The input wire unit mayinclude a plurality of input wires, and each of the input wires mayinclude main wires and branched wires branched from the main wires andconnected to the driving chips.

The driving chips may receive the same data through the input wire unit,and input data may be stored in a corresponding driving chip accordingto the carry signal. The driving chips may output an analog voltage towhich the input data is converted, to the output wire unit according toan input synchronization signal.

Each of the driving chips may include two long sides, and the two longsides may be parallel with the first direction or with a seconddirection crossing the first direction.

An exemplary embodiment provides a curved display device including: asemiconductor chip package including a base film, a driving chip on afirst surface of the base film, an input wire unit and an output wireunit connected to the driving chip, and a plurality of groove portionson a second surface of the base film; a printed circuit board (PCB)connected to the input wire unit; and a display panel including adisplay unit and a pad unit connected to the output wire unit, whereinthe display panel, the semiconductor chip package, and the PCB arebendable in a first direction, and the groove portions arelongitudinally disposed in a second direction crossing the firstdirection.

The groove portions may be densely disposed to have a smaller distanceapart as they are farther distanced from a center of the base film.

An exemplary embodiment provides a curved display device including: asemiconductor chip package including a base film, a driving chip on thebase film, and an input wire unit and an output wire unit connected tothe driving chip; a printed circuit board (PCB) connected to the inputwire unit; and a display panel including a display unit and a pad unitconnected to the output wire unit, wherein the display panel, thesemiconductor chip package, and the printed circuit board are bendablein a first direction, and the output wire unit includes a plurality ofoutput wires having a smaller distance apart as they are fartherdistanced from a center of the base film.

The output wires may be grouped according to kinds of output signals,and the output wires within each group may be disposed at equaldistances apart. The output wires may include first wires disposed atthe center of the base film to output varying signals, and second wiresdisposed at an outer peripheral portion of the base film to output fixedsignals.

The second wires may include third wires for outputting option signals,fourth wires for outputting power signals, and fifth wires foroutputting ground signals, and the third wires, the fourth wires, andthe fifth wires may be sequentially disposed in the stated orderrelative to the first wires.

The output wire unit may include a plurality of output wires, theplurality of output wires at an outer peripheral portion of the basefilm including respective extensions at end portions thereof. The inputwire unit may include a plurality of input wires, the plurality of inputwires at an outer peripheral portion of the base film includingrespective extensions at end portions thereof.

BRIEF DESCRIPTION OF THE DRAWINGS

Features will become apparent to those of ordinary skill in the art bydescribing in detail exemplary embodiments with reference to theattached drawings, in which:

FIG. 1 illustrates a perspective view of a curved display deviceaccording to a first exemplary embodiment;

FIG. 2 illustrates a cross-sectional view along line II-II′ of FIG. 1;

FIG. 3 illustrates a perspective view of a display panel of the curveddisplay device shown in FIG. 1 that is viewed in a direction A;

FIG. 4 illustrates an enlarged cross-sectional view of a region B inFIG. 1;

FIG. 5 illustrates a top plan view of a state of the curved displaydevice shown in FIG. 1 in which a semiconductor chip package isunfolded;

FIG. 6 illustrates a width-directional cross-sectional view of thesemiconductor chip package of the curved display device shown in FIG. 1;

FIG. 7 illustrates a top plan view of an exemplary variation of thesemiconductor chip package shown in FIG. 5;

FIG. 8 illustrates a width-directional cross-sectional view of thesemiconductor chip package shown in FIG. 7;

FIG. 9 illustrates a top plan view of a state of a curved display devicein which a semiconductor chip package is unfolded according to a secondexemplary embodiment;

FIG. 10 illustrates a cross-sectional view along line X-X′ of FIG. 9;

FIG. 11 illustrates a bottom view of the semiconductor chip package inFIG. 9;

FIG. 12 illustrates a schematic diagram of a bent state of thesemiconductor chip package shown in FIG. 10;

FIG. 13 illustrates a top plan view of a state of a curved displaydevice in which a semiconductor chip package is unfolded according to athird exemplary embodiment;

FIG. 14 illustrates a top plan view of a portion of an output wire unitof a semiconductor chip package included in a curved display deviceaccording to a fourth exemplary embodiment;

FIG. 15A and FIG. 15B illustrate top plan views of a portion of anoutput wire unit of a semiconductor chip package included in a curveddisplay device according to a fifth exemplary embodiment; and

FIG. 16A and FIG. 16B illustrate top plan views of a portion of anoutput wire unit of a semiconductor chip package included in a curveddisplay device according to a sixth exemplary embodiment.

DETAILED DESCRIPTION

Example embodiments will now be described more fully hereinafter withreference to the accompanying drawings; however, they may be embodied indifferent forms and should not be construed as limited to theembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey exemplary implementations to those skilled in the art.

In the drawing figures, the dimensions of layers and regions may beexaggerated for clarity of illustration. It will also be understood thatwhen a layer or element is referred to as being “on” another layer orsubstrate, it can be directly on the other layer or substrate, orintervening layers may also be present. Further, it will be understoodthat when a layer is referred to as being “under” another layer, it canbe directly under, and one or more intervening layers may also bepresent. In addition, it will also be understood that when a layer isreferred to as being “between” two layers, it can be the only layerbetween the two layers, or one or more intervening layers may also bepresent. Like reference numerals refer to like elements throughout.

Throughout the specification, unless explicitly described to thecontrary, the word “comprise” and variations such as “comprises” or“comprising” will be understood to imply the further inclusion of otherelements. In addition, the size and thickness of each configurationshown in the drawings are arbitrarily shown for understanding and easeof description, but the present disclosure is not limited thereto.

FIG. 1 illustrates a perspective view of a curved display deviceaccording to a first exemplary embodiment, FIG. 2 illustrates across-sectional view along the line II-II′ of FIG. 1, and FIG. 3illustrates a perspective view of a display panel of the curved displaydevice shown in FIG. 1 that is viewed in a direction A.

Referring to FIGS. 1-3, a curved display device 10 of the firstexemplary embodiment may include a display panel 100, a semiconductorchip package 200, and a printed circuit board (PCB) 300. Thesemiconductor chip package 200 may include a driving chip 201, and isphysically and electrically connected to the display panel 100 and theprinted circuit board 300. As illustrated in FIG. 1, the display panel100, the semiconductor chip package 200, and the printed circuit board300 are concavely bendable in a first direction, e.g., an x-axisdirection, by a predetermined curvature. It is noted that the firstdirection may also be referred to as a horizontal direction.

The display panel 100 includes a substrate 101 with a display area DAdefined on the substrate 101, a display unit 102 having a plurality ofpixels on the substrate 101, a pad unit 103 disposed outside the displayunit 102, and an encapsulation substrate 104 for covering and sealingthe display unit 102. As illustrated in FIG. 3, pad electrodes 105electrically connected to the plurality of pixels are disposed on thepad unit 103.

The display panel 100 may include at least one of an organic lightemitting diode panel, a liquid crystal panel, a plasma display panel,and an electrophoretic display panel. In the case of the organic lightemitting diode panel, the display unit 102 includes at least two thinfilm transistors, at least one capacitor, and one organic light emittingelement in each sub-pixel.

Each of the substrate 101 and the encapsulation substrate 104 may bemade of bendable thin-film glass, or a plastic film, e.g., polyimide,polyethylene terephthalate, polycarbonate, polyethylene naphthalate,polyarylate, and polyether imide. As illustrated in FIG. 2, theencapsulation substrate 104 may be secured to the substrate 101 by asealant 106 which is coated along an edge of the display unit 102.

FIG. 4 illustrates an enlarged cross-sectional view of region B inFIG. 1. As an example, a case of an organic light emitting diode panelas the display panel 100 will be described.

Referring to FIG. 4, a buffer layer 107 may be formed on the substrate101. The buffer layer 107 prevents penetration of impure elements andprovides a flat surface to an upper portion of the substrate 101. Thebuffer layer 107 may contain an inorganic material, e.g., SiO₂ or SiNx,or an organic material, e.g., polyimide, polyester, or acryl.

A thin film transistor (TFT) is formed on the buffer layer 107. The thinfilm transistor (TFT) includes an active layer 108, a gate electrode109, a source electrode 110, and a drain electrode 111. The active layer108 may be made of an inorganic semiconductor, e.g., amorphous siliconor polysilicon, an organic semiconductor, or an oxide semiconductor, andmay include a source region, a drain region, and a channel region. Onedriving thin film transistor is illustrated in FIG. 4.

A gate insulating layer 112 is formed on the active layer 108. The gateinsulating layer 112 insulates the active layer 108 and the gateelectrode 109 from each other, and may include an inorganic material,e.g., SiO₂ or SiNx, or an organic material. The gate electrode 109 isformed on the gate insulating layer 112. The gate electrode 109 may bedisposed to overlap the channel region of the active layer 108, and mayinclude, e.g., Au, Ag, Cu, Ni, Pt, Pd, Al, Mo, or the like.

An interlayer insulating layer 113 is formed on the gate electrode 109.The interlayer insulating layer 113 is disposed between the gateelectrode 109 and the source electrode 110 and between the gateelectrode 109 and the drain electrode 111 to insulate therebetween. Theinterlayer insulating layer 113 may include an inorganic material, e.g.,SiO₂ or SiNx, and may have a dual-layer structure, e.g., a SiO₂ layerand a SiNx layer.

The source electrode 110 and a drain electrode 111 are formed on theinterlayer insulating layer 113. In this case, via holes are formed inthe interlayer insulating layer 113 and the gate insulating layer 112 toexpose the source region and the drain region of the active layer 108,and the source electrode 110 and the drain electrode 111 respectivelycontact the source region and the drain region of the active layer 108through the via holes.

In FIG. 4, a top-gate thin film transistor is illustrated as an example,but the structure of the thin film transistor is not limited thereto.The thin film transistor is covered with a passivation layer 114 to beprotected thereby, and is electrically connected to the organic lightemitting diode to drive the organic light emitting diode.

The passivation layer 114 may be formed of an inorganic insulating layeror an organic insulator, or may be formed to have a structure in whichthe inorganic insulating layer and the organic insulator are stacked.The inorganic insulating layer may include, e.g., SiO₂, SiNx, Al₂O₃,TiO₂, Ta₂O₅, HfO₂, ZrO₂, or the like, and the organic insulator mayinclude, e.g., polymethyl methacrylate (PMMA), polystyrene (PS), anacryl-based polymer, an imide-based polymer, an arylether-based polymer,or the like.

The organic light emitting diode is formed on the passivation layer 114,and includes a pixel electrode 115, an interlayer 116, and a commonelectrode 117. One pixel electrode 115 is provided for each sub-pixel,and contacts the drain electrode 111 through a via hole formed in thepassivation layer 114. The common electrode 117 is formed on the entiredisplay area DA. When the display panel 100 is a bottom emission type,the pixel electrode 115 is a transparent or translucent electrode, andthe common electrode 117 is a reflective electrode.

The pixel electrode 115 may be formed of a metal thin film including atleast one of, e.g., Li, Ca, LiF/Ca, LiF/Al, Al, Ag, Mg, or the like, andan auxiliary electrode layer including at least one of, e.g., ITO, IZO,ZnO, In₂O₃, or the like may be formed on the metal thin film. The commonelectrode 117 may include a reflective film including at least one of,e.g., Au, Ag, Mg, Al, Pt, Pd, Ni, Nd, Ir, Cr, or the like, and atransparent or translucent layer formed on the reflective film. Thetransparent or translucent layer may include, e.g., ITO (indium tinoxide), IZO (indium zinc oxide), ZnO, In₂O₃, or the like.

A pixel defining layer 118 is formed on the pixel electrode 115. Thepixel defining layer 118 exposes a predetermined portion of the pixelelectrode 115, and the interlayer 116 including an organic emissionlayer is formed on the exposed pixel electrode 115. The organic emissionlayer may be a low molecular weight organic material or a high molecularweight organic material, and the interlayer 116 may include at least oneof a hole injection layer, a hole transport layer, an electron transportlayer, and an electron injection layer, in addition to the organicemission layer.

Light emitted from the organic emission layer is reflected by the commonelectrode 117, and is discharged to the outside through the pixelelectrode 115 and the substrate 101. The display panel 100 of thepresent exemplary embodiment is not limited to the bottom emission type,and may be a top emission type or a both-sides emission type. In thecase of the top emission type, the pixel electrode 115 is a reflectiveelectrode, and the common electrode 117 is a transparent electrode or atranslucent electrode.

Referring back to FIGS. 1-3, the aforementioned display unit 102includes a plurality of gate lines (not shown), a plurality of datalines (not shown) disposed to cross the gate lines while maintaininginsulation from the gate lines, and a plurality of common power lines(not shown).

The pad unit 103 is disposed at a side of the display unit 102 along asecond direction (a y-axis direction). For example, as illustrated inFIG. 3, the pad unit 103 may be disposed below the display unit 102along the y-axis direction. The pad electrodes 105 formed in the padunit 103 may be connected to the data lines and the common power linesin the display unit 102, and the driving chip 201 of the semiconductorchip package 200 attached to the pad unit 103 may serve as a data driver(source driver) for outputting a data signal to the data lines.

As illustrated in FIG. 2, the semiconductor chip package 200 may includea base film 202, the driving chip 201 mounted on the base film 202, andan input wire unit 203 and an output wire unit 204 formed on the basefilm 202 to be electrically connected to the driving chip 201. Asillustrated in FIG. 1, a plurality of semiconductor chip packages 200may be separated from each other along the first direction, e.g., alongthe x-axis direction, on the pad unit 103.

The base film 202 may be formed of a plastic film, e.g., polyimide. Thedriving chip 201 may be bonded on the base film 202 through an electrodebump in a flip-chip method. A portion to which the driving chip 201 isbonded is protected from the external environment by a resin layerfilled by an underfill method

The input wire unit 203 is disposed at one side of the driving chip 201,and the output wire unit 204 is disposed at another side thereof. Eachof the input wire unit 203 and the output wire unit 204 includes aplurality of wires, and remaining regions other than end portions of theinput wire unit 203 and the output wire unit 204 are covered andprotected by solder resists (not shown).

A first end of the semiconductor chip package 200 is attached to theprinted circuit board 300 by a first anisotropic conductive film 401.Accordingly, pad electrodes (not shown) of the printed circuit board 300are electrically connected to the input wire unit 203, and the printedcircuit board 300 outputs a signal for controlling the driving chip 201through the input wire unit 203.

A second end of the semiconductor chip package 200 is attached to thepad unit 103 of the display panel 100 through a second anisotropicconductive film 402. Accordingly, the pad electrodes 105 of the pad unit103 are electrically connected to the output wire unit 204, and anoutput signal of the driving chip 201 is transferred to the padelectrodes 105.

When a direction passing through the input wire unit 203, the drivingchip 201, and the output wire unit 204 is referred to as ‘a longitudinaldirection’ of the semiconductor chip package 200, the semiconductor chippackage 200 is bent along the longitudinal direction thereof such thatthe printed circuit board 300 is overlapped with the display panel 100.In other words, the ‘longitudinal direction’ extends along the y-axisdirection of FIG. 1.

The printed circuit board 300 faces a side that is opposite to a displaysurface. In FIG. 2, reference numeral 119 indicates a buffer memberdisposed between the encapsulation substrate 104 and the printed circuitboard 300. The buffer member 119 may be omitted.

As the display panel 100 is bent along the first direction with apredetermined curvature, i.e., along the x-axis direction, thesemiconductor chip package 200 receives a force that allows it to bebent along ‘a transversal direction’ that crosses the longitudinaldirection with the same curvature as that of the display panel 100. Inother words, the semiconductor chip package 200 is bent along the firstdirection, i.e., along the x-axis direction, together with the displaypanel 100 to have the same predetermined curvature as the display panel100. In this case, the base film 202 of the semiconductor chip package200 and the printed circuit board 300 may have flexibility that issimilar to that of the display panel 100, while the driving chip 201 hasno flexibility or extremely low flexibility.

Accordingly, since a driving chip may have little or no flexibility,stress may be generated around the driving chip during bending of theconventional semiconductor chip package with the flexible display panel.Therefore, according to exemplary embodiments, the driving chip 201 mayinclude a plurality of driving chips spaced apart from each other alongthe bending direction, thereby relieving stress around the driving chip201 during bending. This will be described in more detail below withreference to FIGS. 5-6.

FIG. 5 illustrates a top plan view of an unfolded semiconductor chippackage 200 on the curved display device 10. It is noted that theunfolded semiconductor chip package refers to a semiconductor chippackage that is not bent, i.e., in a flat state.

Referring to FIG. 5, the semiconductor chip package 200 includes aplurality of driving chips 2011, 2012, and 2013 that are spaced apartfrom each other along the transversal direction, i.e., the horizontaldirection as viewed in FIG. 5, rather than including a single drivingchip. In detail, higher resolution of the display unit 102 may furtherincrease the number of channels, thereby lengthening the driving chip.However, if a semiconductor chip package were to include a bendabledriving chip having a long length, a crack could be generated in thelong driving chip. Further, minute peeling could be generated betweenthe long driving chip and the input wire unit or between the longdriving chip and the output wire unit.

In contrast, according to the present exemplary embodiment, thesemiconductor chip package 200 includes a plurality of driving chips,e.g., driving chips 2011, 2012, and 2013, that are spaced apart fromeach other. The plurality of driving chips is connected by a cascademethod while maintaining the same number of channels as that ofconventional channels. That is, the driving chips 2011, 2012, and 2013are divided to be separated from each other, and the input wire unit 203is connected together, e.g., simultaneously, to the driving chips 2011,2012, and 2013. The driving chips 2011, 2012, and 2013 may be connectedto each other by a connection wire 205 for transferring a carry signal.

Each of the input wires of the input wire unit 203 includes a pluralityof main wires 2081, 2082, 2083, and 2084 connected to the printedcircuit board 300, and a plurality of branched wires 2091, 2092, 2093,and 2094 that are branched from the respective main wires 2081, 2082,2083, and 2084 and are connected to each of the driving chips 2011,2012, and 2013. All of the branched wires 2091, 2092, 2093, and 2094 areinsulated from each other.

Corresponding data is input into any one of the main wires 2081, 2082,2083, and 2084. Data output from the main wires 2081, 2082, 2083, and2084 may be simultaneously transferred to the driving chips 2011, 2012,and 2013 through the branched wires 2091, 2092, 2093, and 2094.

For example, first data is input into the first main wire 2081, and thefirst data is simultaneously transferred to the driving chips 2011,2012, and 2013 through the first branched wires 2091 branched from thefirst main wire 2081. Second data is input into the second main wire2082, and the second data is simultaneously transferred to the drivingchips 2011, 2012, and 2013 through the second branched wires 2092branched from the second main wire 2082.

Three divided driving chips 2011, 2012, and 2013 are illustrated in FIG.5, but the number of driving chips is not limited thereto. Further, forconvenience of illustration, the input wire unit 203 including fourinput wires is illustrated in FIG. 5 as an example, but the number ofinput wires may be greater than that of the illustrated input wires. Theoutput wire unit 204 includes output wires that are connected to thedriving chips 2011, 2012, and 2013.

In the semiconductor chip package 200 having the aforementionedstructure, the same data may be input into all the driving chips 2011,2012, and 2013, and the input data may be stored in a corresponding oneof the driving chips 2011, 2012, and 2013 according to the carry signalthat is applied from each of the driving chips 2011, 2012, and 2013.

For example, when the same first data is input into the first to thirddriving chips 2011, 2012, and 2013, the first data is stored in thefirst driving chip 2011 according to a start signal. Once the first datais completely stored, the carry signal may be transferred from the firstdriving chip 2011 to the second driving chip 2012 through the connectionwire 205. An additional input wire may be connected to the first drivingchip 2011 to apply the start signal.

When the same second data is input into the first to third driving chips2011, 2012, and 2013 together with the transferring of the carry signal,the second data is stored in the second driving chip 2012 by the carrysignal transferred to the second driving chip 2012. Once the second datais completely stored, the carry signal may be transferred from thesecond driving chip 2012 to the third driving chip 2013 through theconnection wire 205. When the same third data is input into the first tothird driving chips 2011, 2012, and 2013 together with the transferringof the carry signal, the third data is stored in the third driving chip2013 by the carry signal transferred to the third driving chip 2013.

Next, the first to third driving chips 2011, 2012, and 2013 mayrespectively and simultaneously output analog voltages, to which firstdata to third data are converted, to output wires by a synchronizationsignal and the like applied from the outside of the driving chip. Inthis case, an additional input wire (not shown) may be connected to eachof the driving chips 2011, 2012, and 2013 to apply the synchronizationsignal.

Further, the third driving chip 2013 can generate a synchronizationsignal according to an input carry signal to transfer it to the seconddriving chip 2012 and the first driving chip 2011. According to thetransferred synchronization signal, analog voltages, to which first datato third data are converted, may be simultaneously output tocorresponding output wires. In this case, an additional wire (not shown)may be disposed between the third driving chip 2013 and the seconddriving chip 2012 and between the third driving chip 2013 and the firstdriving chip 2011.

For example, when a synchronization signal is output from the thirddriving chip 2013 to the second driving chip 2012 and the first drivingchip 2011, the first driving chip 2011 may output an analog voltage, towhich input first data is converted, to output wires connected to thefirst driving chip 2011 by input of the synchronization signal.Similarly, the second driving chip 2012 may output an analog voltage, towhich input second data is converted, to output wires connected to thesecond driving chip 2012 by input of the synchronization signal. In thiscase, the third driving chip 2013 outputting the synchronization signalmay also output an analog voltage, to which input third data isconverted, to output wires connected to the third driving chip 2013 byinput of the synchronization signal.

FIG. 6 illustrates a width-directional cross-sectional view of thesemiconductor chip package 200 in FIG. 1.

Referring to FIG. 5 and FIG. 6, as the semiconductor chip package 200includes the driving chips 2011, 2012, and 2013 divided, e.g., spacedapart, along the transversal direction, the semiconductor chip package200 is more flexibly bendable along the transversal direction, e.g., ascompared with a semiconductor chip package including a single longdriving chip along the transversal direction. As such, stress caused bybending around the driving chips 2011, 2012, and 2013 may be moreefficiently reduced.

Accordingly, the curved display device 10 according to the firstexemplary embodiment can suppress generation of defects such as cracksof the driving chips 2011, 2012, and 2013, cracks of the input wire unit203 or the output wire unit 204, minutely peeling between the drivingchips 2011, 2012, and 2013 and the input wire unit 203 or the outputwire unit 204, peeling between the semiconductor chip package 200 andthe pad unit 103, and peeling between the semiconductor chip package 200and the printed circuit board 300, which may be generated in a bendingcondition, and can improve durability and reliability of products.

In FIG. 5, the case that each of the driving chips 2011, 2012, and 2013is longitudinally disposed in a transversal direction is illustrated. Inother words, each of the driving chips 2011, 2012, and 2013 may have twolong sides that are parallel with the transversal direction. In thiscase, an entirety of the input wire unit 203 and a part of the outputwire unit 204 may be connected to each of the long sides of the drivingchips 2011, 2012, and 2013, and a part of the output wire unit 204 andthe connection wires 205 may be connected to each of the short sides ofthe driving chips 2011, 2012, and 2013.

FIG. 7 illustrates a top plan view of an exemplary variation of thesemiconductor chip package shown in FIG. 5, and FIG. 8 illustrates awidth-directional cross-sectional view of the semiconductor chip packageshown in FIG. 7.

Referring to FIG. 7 and FIG. 8, each of a plurality of driving chips2014, 2015, and 2016 may be longitudinally disposed in a longitudinaldirection (i.e., a vertical direction on the basis of the drawings) ofthe semiconductor chip package 210. In other words, each of the drivingchips 2014, 2015, and 2016 may have two long sides that are parallelwith the longitudinal direction.

In this case, each width of the driving chips 2014, 2015, and 2016becomes smaller than that of FIG. 5. Accordingly, the semiconductor chippackage 210 according to the exemplary variation is more flexiblybendable along the transversal direction as compared with the structureshown in FIG. 5, and a stress caused by bending around the driving chips2014, 2015, and 2016 may be further reduced.

FIG. 9 illustrates a top plan view of an unfolded semiconductor chippackage in a curved display device according to a second exemplaryembodiment, and FIG. 10 illustrates a cross-sectional view along lineX-X′ of FIG. 9. FIG. 11 illustrates a bottom view of the semiconductorchip package shown in FIG. 9.

Referring to FIG. 9 to FIG. 11, in the second exemplary embodiment, asemiconductor chip package 220 may include a single driving chip 201′,and provides a condition by which a base film 202 can be more flexiblybent. Since the constituent elements of the curved display deviceaccording to the second exemplary embodiment are the same as those ofthe first exemplary embodiment, except for the semiconductor chippackage 220, the semiconductor chip package 220 will be mainly describedbelow.

The driving chip 201′ is longitudinally disposed on a first surface 2021of the base film 202 along a transversal direction (i.e., a horizontaldirection on the basis of the drawing) of the semiconductor chip package220. The input wire unit 203 is connected to a first long side of thedriving chip 201′ at a side of the driving chip 201′, and the outputwire unit 204 is connected to a second long side of the driving chip201′ at an opposite side of the driving chip 201′. Since the number ofwires of the output wire unit 204 is larger than that of wires of theinput wire unit 203, some of the output wires may be connected to thefirst long side of the driving chip 201′.

As illustrated in FIGS. 10-11, a plurality of groove portions 206 areformed at a second surface 2022 of the base film 202 in parallel withthe longitudinal direction (i.e., a vertical direction) of thesemiconductor chip package 220. A cross-section of each of the grooveportions may have a V-shape (FIG. 10), and the groove portions 206 aredisposed in parallel to be separated from each other. The plurality ofgrooves 206 may extend along the entire length of the second surface2022, as illustrated in FIG. 11. In this case, the groove portions 206may be formed to have a smaller distance between adjacent grooveportions 206 as they are farther distanced from the center of the basefilm 202.

For example, the groove portions 206 may be disposed to have a largedistance between adjacent groove portions 206 at the center of the basefilm 202, and may be disposed to have a smaller distance betweenadjacent groove portions 206 at edges of the base film 202. Accordingly,when a force causing transversal bending is applied to the base film202, the base film 202 is flexibly bendable due to the groove portions206. Particularly, the base film 202 may be more easily bendable at anedge at which the groove portions 206 are densely disposed.

FIG. 12 illustrates a schematic diagram of a bent state of thesemiconductor chip package shown in FIG. 10.

When a single, long semiconductor chip package is formed on a base filmwith no groove portions, when an external force causing transversalbending is applied, stress is generated in the base film. In contrast,referring to FIGS. 9-12, the semiconductor chip package 220 of thesecond exemplary embodiment includes a plurality of the groove portions206. Therefore, when an external force causing transversal bending isapplied, portions of the base film 202 at which the groove portions areformed are easily bent, and thus the base film 202 is easily bent alongthe transversal direction.

Accordingly, the semiconductor chip package 220 according to the secondexemplary embodiment may flexibly adjust with the bending of the basefilm 202, and defects, e.g., cracks of the driving chip 201′ or thewires and peeling of the semiconductor chip package 220 from the displaypanel 100 or the printed circuit board 300, may be efficientlysuppressed from being generated.

FIG. 13 illustrates a top plan view of an unfolded semiconductor chippackage in a curved display device according to a third exemplaryembodiment.

Referring to FIG. 13, in the third exemplary embodiment, a semiconductorchip package 230 includes the single driving chip 201′, and has astructure in which wires of an output wire unit 204′ are disposed tohave different distances apart according to a curvature (i.e., a bendinglevel) thereof. Since the constituent elements of the curved displaydevice according to the third exemplary embodiment are the same as thoseof the first exemplary embodiment, except for the semiconductor chippackage 230, the semiconductor chip package 230 will be mainly describedbelow.

The driving chip 201′ is longitudinally disposed on the base film 202along a transversal direction (i.e., a horizontal direction on the basisof the drawing) of the semiconductor chip package 230. The input wireunit 203 is connected to a first long side of the driving chip 201′ at aside of the driving chip 201′, and the output wire unit 204′ isconnected to a second long side of the driving chip 201′ at an oppositeside of the driving chip 201′. The output wire unit 204′ includes outputwires 2041, and the output wires 2041 are more densely disposed to havea smaller distance apart as they are closer to an edge of the base film202.

The semiconductor chip package 230 is also bendable according to thecurvature of the display panel 100. In this case, the curvature may bechanged according to positions even at the inside of the semiconductorchip package 230. For example, the curvature of the center of the basefilm 202 close to the driving chip 201 may be larger than that of anouter periphery of the base film 202 distanced from the driving chip201. A portion having a larger curvature receives a relatively largertensile stress than that of a portion having a smaller curvature.

The output wires 2041 may be disposed to have short distances apart atan outer peripheral portion of the base film 202 which is largely bent,to increase a stress of the outer peripheral portion. Further, when endportions of the output wires 2041 are attached to the pad unit 103 ofthe display panel 100 by the second anisotropic conductive film 402 (seeFIG. 2), it is possible to increase an adhesive area of the output wires2041 and the pad unit 103 at the largely bent outer peripheral portionof the base film 202. As a result, a repulsive power of the outerperipheral portion caused by bending can be reduced.

As such, it is possible to increase the stress of the largely bent outerperipheral portion and decrease the repulsive power caused by thebending by forming the output wires 2041 to have different distancesapart. As a result, the stress caused by the bending can be reduced toefficiently suppress generation of defects, e.g., cracks of the drivingchip 201′ or the wires and peeling of the semiconductor chip package 230from the display panel 100 or the printed circuit board 300.

FIG. 14 illustrates a top plan view of a portion of an output wire unitof a semiconductor chip package included in a curved display deviceaccording to a fourth exemplary embodiment.

Referring to FIG. 14, in the fourth exemplary embodiment, asemiconductor chip package 240 includes the same or similar constituentelements as those of the aforementioned third exemplary embodiment,except for grouping of output wires of an output wire unit 204″.Constituent elements that are different from those of the thirdexemplary embodiment will be mainly described.

In detail, the output wires are grouped into first wires 2042 foroutputting changed, e.g., varying, signals, e.g., image data, and secondwires 2043 for outputting fixed signals. The first wires 2042 aredisposed at a center of the base film 202 having a small curvature, andthe second wires 2043 are disposed at an outer peripheral portion of thebase film 202 having a large curvature. The first wires 2042 may bedisposed at equal distances apart, and a first distance g1 betweenadjacent first wires 2042 is larger than a distance between adjacentsecond wires 2043.

The second wires 2043 may be divided into a plurality of wires accordingto kinds of signals. For example, the second wires 2043 may be dividedinto third wires 2044 for outputting option signals, fourth wires 2045for outputting power signals, and fifth wires 2046 for outputting groundsignals. The third wires 2044, the fourth wires 2045, and the fifthwires 2046 may be sequentially disposed in that order be close, e.g.,relative, to the first wires 2042.

The third wires 2044 may be disposed at equal distances apart, and athird distance g3 between the third wires 2044 is smaller than the firstdistance g1. The fourth wires 2045 may be disposed at equal distancesapart, and a fourth distance g4 between adjacent fourth wires 2045 issmaller than the third distance g3. The fifth wires 2046 may be disposedat equal distances apart, and a fifth distance g5 between adjacent fifthwires 2046 is smaller than the fourth distance g4. A pitch of the fifthwires 2046 satisfies a permissible pitch range by which the bonding canbe possible.

Since the third wires 2044, the fourth wires 2045, and the fifth wires2046 output signals of the same polarity, it is possible to reduce adriving error possibility caused by a progressive circuit-short evenwhen a distance between wires is set to be small.

FIG. 15A and FIG. 15B illustrate top plan views of a portion of anoutput wire unit of a semiconductor chip package included in a curveddisplay device according to a fifth exemplary embodiment.

Referring to FIG. 15A and FIG. 15B, in the fifth exemplary embodiment, asemiconductor chip package 250 has the same constituent elements asthose of the semiconductor chip package according to any one of thefirst to fourth exemplary embodiments. In FIG. 15A and FIG. 15B, theoutput wire unit of the first exemplary embodiment is illustrated as abasic structure, and constituent elements that are different from theaforementioned exemplary embodiments will be mainly described.

A second end of the semiconductor chip package 250, at which an endportion of an output wire unit 204 a is disposed, is attached to the padunit 103 of the display panel 100 by the second anisotropic conductivefilm 402 (see FIG. 2). End portions of output wires 2047 of the outputwire unit 204 a are electrically connected to the pad electrodesincluded in the pad unit 103 by a conductive ball (not shown) includedin the second anisotropic conductive film 402.

The size of the end portions of ones disposed at an outer peripheralportion of the base film 202 among the output wires 2047 is increased byforming an extension 207 at the corresponding end portion. The outerperipheral portion of the base film 202 is largely bent, and thusconcentratedly receives a stress. Accordingly, by expanding an attachedarea of the output wires 2047 to the pad unit 103, it is possible toreduce a repulsive power of the outer peripheral portion caused bybending. As a result, it is possible to suppress the peeling of theoutput wires 2047 caused by the bending.

The extension 207 may be formed to have a quadrangular shape. Theextension 207 may be connected to one side of the corresponding outputwire 2047 (see FIG. 15A), or may be connected to the center of an endportion of the corresponding output wire 2047 to form a T shape togetherwith the output wiring 2047

In the meantime, the printed circuit board 300 may also be bendable withthe same curvature as that of the display panel 100, and thus an inputwire unit 203 a may also include an extension. FIG. 16A and FIG. 16Billustrate top plan views of a portion of an output wire unit of asemiconductor chip package included in a curved display device accordingto a sixth exemplary embodiment.

Referring to FIG. 16A and FIG. 16B, in the sixth exemplary embodiment, asemiconductor chip package 260 includes the same constituent elements asthose of the aforementioned fifth exemplary embodiment, except for theinput wire unit 203 a. Constituent elements that are different from theaforementioned exemplary embodiments will be mainly described.

The size of the end portions of ones disposed at an outer peripheralportion of the base film 202 among input wires 2031 is increased byforming the extension 207 at the corresponding end portion. Accordingly,it is possible to reduce a repulsive power of the outer peripheralportion caused by bending. As a result, the peeling of the input wires2031 caused by the bending can be suppressed.

The extension 207 may be formed to have a quadrangular shape. Theextension 207 may be connected to the center of an end portion of acorresponding input wire 2031 to form a T shape together with the inputwiring 2031 (see FIG. 16A), or may be connected to one side of thecorresponding input wire 2031 (see FIG. 16B).

By way of summation and review, a conventional semiconductor chippackage may be attached to a display panel to be bent along alongitudinal direction. In this case, a base film of the semiconductorchip package has flexibility that is similar to that of the displaypanel, but the driving chip of the semiconductor chip package has littleor no flexibility. Accordingly, stress is generated around the drivingchip during bending.

The stress caused by the bending may result in cracks in the drivingchip or in the wires, or may cause peeling of semiconductor chip packageoff the display panel or the printed circuit board. Further, as ahorizontal width of the curved display device is widened and the bendinglevel is increased vulnerability of the semiconductor chip packagecaused by the stress is further increased.

In contrast, according to embodiments, a curved display device cansuppress generation of defects such as cracks in the driving chips,cracks of the input wire unit or the output wire unit, minute peelingbetween the driving chips and the input wire unit or the output wireunit, peeling between the semiconductor chip package and the pad unit,and peeling between the semiconductor chip package and the printedcircuit board, which may be generated in a bending condition, and canimprove durability and reliability of products.

Example embodiments have been disclosed herein, and although specificterms are employed, they are used and are to be interpreted in a genericand descriptive sense only and not for purpose of limitation. In someinstances, as would be apparent to one of ordinary skill in the art asof the filing of the present application, features, characteristics,and/or elements described in connection with a particular embodiment maybe used singly or in combination with features, characteristics, and/orelements described in connection with other embodiments unless otherwisespecifically indicated. Accordingly, it will be understood by those ofskill in the art that various changes in form and details may be madewithout departing from the spirit and scope of the present invention asset forth in the following claims.

What is claimed is:
 1. A curved display device, comprising: asemiconductor chip package including a base film, a plurality of drivingchips on the base film, and an input wire unit and an output wire unitconnected to the driving chips; a printed circuit board (PCB) connectedto the input wire unit of the semiconductor chip package; and a displaypanel including a display unit and a pad unit connected to the outputwire unit of the semiconductor chip package, wherein the display panel,the semiconductor chip package, and the PCB are bendable and are curvedin a first direction, and the driving chips of the semiconductor chippackage are separated from each other along the curve in the firstdirection.
 2. The curved display device as claimed in claim 1, wherein:the input wire unit is simultaneously connected to the plurality ofdriving chips, and a connection wire for transferring a carry signal isdisposed between adjacent driving chips.
 3. The curved display device asclaimed in claim 2, wherein the input wire unit includes a plurality ofinput wires, each of the input wires including main wires and branchedwires branched from the main wires and connected to the driving chips.4. The curved display device as claimed in claim 3, wherein the drivingchips receive the same data through the input wire unit, and input datais stored in a corresponding driving chip according to the carry signal.5. The curved display device as claimed in claim 4, wherein the drivingchips output an analog voltage, to which the input data is converted, tothe output wire unit according to an input synchronization signal. 6.The curved display device as claimed in claim 1, wherein each of thedriving chips includes two long sides, the two long sides being parallelwith the first direction or with a second direction crossing the firstdirection.
 7. A curved display device, comprising: a semiconductor chippackage including a base film, a driving chip on a first surface of thebase film, an input wire unit and an output wire unit connected to thedriving chip, and a plurality of groove portions on a second surface ofthe base film; a printed circuit board (PCB) connected to the input wireunit; and a display panel including a display unit and a pad unitconnected to the output wire unit, wherein the display panel, thesemiconductor chip package, and the PCB are bendable in a firstdirection, and the groove portions are longitudinally disposed in asecond direction crossing the first direction.
 8. The curved displaydevice as claimed in claim 7, wherein the groove portions are denselydisposed to have a smaller distance apart as they are farther distancedfrom a center of the base film.
 9. A curved display device, comprising:a semiconductor chip package including a base film, a driving chip onthe base film, and an input wire unit and an output wire unit connectedto the driving chip; a printed circuit board (PCB) connected to theinput wire unit; and a display panel including a display unit and a padunit connected to the output wire unit, wherein the display panel, thesemiconductor chip package, and the printed circuit board are bendablein a first direction, and the output wire unit includes a plurality ofoutput wires having a smaller distance apart as they are fartherdistanced from a center of the base film.
 10. The curved display deviceas claimed in claim 9, wherein the output wires are grouped according tokinds of output signals, the output wires within each group beingdisposed at equal distances apart.
 11. The curved display device asclaimed in claim 10, wherein the output wires include: first wiresdisposed at the center of the base film to output varying signals; andsecond wires disposed at an outer peripheral portion of the base film tooutput fixed signals.
 12. The curved display device as claimed in claim11, wherein: the second wires include third wires for outputting optionsignals, fourth wires for outputting power signals, and fifth wires foroutputting ground signals, and the third wires, the fourth wires, andthe fifth wires are sequentially disposed in the stated order relativeto the first wires.
 13. The curved display device as claimed in claim 9,wherein the output wire unit includes a plurality of output wires, theplurality of output wires at an outer peripheral portion of the basefilm including respective extensions at end portions thereof.
 14. Thecurved display device as claimed in claim 13, wherein the input wireunit includes a plurality of input wires, the plurality of input wiresat an outer peripheral portion of the base film including respectiveextensions at end portions thereof.